WB-1

Wire Bonder

Nanofabrication Facility

MAKE

West Bond

MODEL

N/A

LOCATION

G27 LISE

Wedge bonder configured for aluminum wire. It will attach to pads down to 100 microns square in a feature density of 150 microns (pad to pad). The system is tuned for bonding the wire to Au but will work on Al ,Cu with a tip change and some parameter adjustment.

Contact staff for training information.

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