FCB-1

Finetech Flip Chip Bonder

Nanofabrication Facility

MAKE

Finetech

MODEL

Fineplacer

LOCATION

G27 LISE

Fineplacer Lambda Manual Sub-Micron Flip-Chip Bonder provides accurate alignment and placement of a device chip to a substrate as an advanced form of chip interconnection. During the bonding process, both chip and substrate are typically heated to an alloying temperature of the interconnect material. Also available is a heated pick and place tool which allows for heating the device chip in a full thermocompression bonding process.

Contact staff for training information.

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