OL-8

EVG 620 Mask Aligner

Nanofabrication Facility

MAKE

EVG

MODEL

620

LOCATION

Cleanroom G07 LISE

1. Introduction
EVG 620 mask aligner is a high-resolution photolithography tool capable of performing both topside and backside alignment. With the current setup the tool can process 6″ wafers. The EVG 620 is the most automated mask aligner in the CNS cleanroom.
It is capable of prepositioning the optical system (objectives) to a pre-assigned coordinate making future processing more convenient. With the help of 10X objectives for both top and bottom alignment you can get up too ~1.5 um alignment accuracy.

2. Application
Major functions, features, and benefits:
a) Topside(TSA) and Backside(BSA) alignment
b) Achievable exposure resolution ~1 um, alignment resolution ~ 1.5um
c) Only 6″ wafer is allowed
d) Able to perform soft, hard, low vacuum and vacuum contact, as well as proximity exposure
e) Restricted to positive-tone photoresists.

Please contact staff for information on training.

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