EVG 620 Mask Aligner
Cleanroom G07 LISE
EVG 620 mask aligner is a high-resolution photolithography tool capable of performing both topside and backside alignment. With the current setup the tool can process 6″ wafers. The EVG 620 is the most automated mask aligner in the CNS cleanroom.
It is capable of prepositioning the optical system (objectives) to a pre-assigned coordinate making future processing more convenient. With the help of 10X objectives for both top and bottom alignment you can get up too ~1.5 um alignment accuracy.
Major functions, features, and benefits:
a) Topside(TSA) and Backside(BSA) alignment
b) Achievable exposure resolution ~1 um, alignment resolution ~ 1.5um
c) Only 6″ wafer is allowed
d) Able to perform soft, hard, low vacuum and vacuum contact, as well as proximity exposure
e) Restricted to positive-tone photoresists.