WB-2

EVG 501 Wafer Bonder

Nanofabrication Facility

MAKE

EVG

MODEL

501

LOCATION

Cleanroom G07 LISE

The EVG 501 is a wafer bonding station capable of running 6″ substrate with the current setup we have. Tool has the capability of doing:

* Eutectic bonding

* Β Uses temperature and pressure only

* Uses an intermediate metal layer (usually gold)

* Thermal compression bonding

* Uses temperature and pressure only

* Bonding of metal to metal layers

* Direct or fusion bonding

* Can be done only with oxide intermediate layer to lower the bonding temperature

* Bonding quality IR testing

* Use IR projector to verify the bounding uniformity and rough alignment check

Contact staff for training information.

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