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EVG 150 Automated Wafer Coater/Developer

Nanofabrication Facility

MAKE

EVG

MODEL

150

LOCATION

Cleanroom G07 LISE

EVG 150 is an automated wafer coater/developer system capable of coating, baking and developing 4″ and 6″ wafers. Supplying three different resists and two developers, EVG 150 can load up to 25 wafers for batch coating and developing process. It also has spray-coating capabilities for better sidewall coverage of high aspect ratio features. With automatic resist dispensing it has good resist thickness control. The controllable topside and bottom side Edge bead removal provides an advantage to get a good contact for mask aligners and avoid resist contamination in further processing. 4 hotplates and two chill plates are available for Soft and/or Hard baking. By setting up the correct recipe a robot can be used to load the wafers in to any of the coat, bake, chill and dev elop stations Materials provided in EVG 150 include: three resists (SPRTM 700-1.0, SPRTM 220-3.0 and AZ4620), two developers (AZ300-MIF and CD-26). For spray coating several resists can be used with preapproval from CNS staff.

Training provided upon request.

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