OL-2

AB-M Mask Aligner

NanoMaterials Facility

MAKE

AB-M

MODEL

N/A

LOCATION

Soft Materials Cleanroom G07 LISE

This mask alignment and exposure system has a table-top configuration and offers Mid UV and Deep UV (248nm with filter change) exposure capabilities. It is a contact aligner with precision x, y, z and substrate rotation controls. It has a single-field high magnification zoom microscope for alignment. We provide three circular vacuum chucks for 2″, 3″ and 4″ wafers, as well as a rectangular chuck for small samples, with Wedge Compensation (Planarizing) feature. The aligner has two mask holders for 4″x4″ and 5″x5″ sized masks, ideal for 3″ and 4″ wafers respectively. The minimum feature size that can be achieved on this system is about 2 micrometers. (However the practical limit will ultimately depend on the mask resolution, the photoresist type, thickness and uniformity, and the level of contact between the photoresist layer and the mask.)

contact Ilke Akartuna akartuna@seas.harvard.edu for training information

Logins

doubleArrow-right